BARCELONA, Spain, Feb. 26, 2013 /PRNewswire/ -- Mobile World Congress - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that its customers, partners and CEVA-powered OEMs have come out in full force at Mobile World Congress 2013, debuting a wide range of new products, solutions and end-market devices at the show. Leveraging on the ultra-low power and industry-leading performance enabled by CEVA's DSPs and platforms, many of the more than fifty CEVA customers, partners and OEMs participating at the Congress introduced new products and solutions. Highlights include:
Technologies on display at CEVA's booth include:
More information and video footage of the innovative technology demonstrations on display at CEVA's booth can be found online at CEVA's Mobile World Congress Virtual Booth – to view, visit http://events.ceva-dsp.com/mwc/
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA's IP was shipped in more than 1 billion devices, powering smartphones from many of the world's leading OEMs, including HTC, Huawei, Lenovo, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
SOURCE CEVA, Inc.