NXP IQ Modulators Feature Highest Dynamic Range With DC-Independent DAC Interfacing
High Linearity and Low Noise 5V Wideband IQ Modulators Also Feature Lowest Power Consumption and Excellent Switching Performance for TDD Systems

EINDHOVEN, THE NETHERLANDS -- (Marketwire) -- 10/31/12 -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced two 5V wideband IQ modulator devices that combine high dynamic range with fast on/off switching performance for use in radio frequency up-conversion. Operating between 400 MHz and 4 GHz, the BGX7100 and BGX7101 consume less than 1 W power -- 10-percent more efficient than other solutions on the market today. Because RF performance is independent of input common mode voltage, these modulators offer flexible interfacing with any DAC, simplifying design-in, and lowering the bill of materials. A video demonstration of NXP's IQ modulators is available here: http://youtu.be/gjyuwyui0IU

Applications of the rugged BGX710x series are in wireless infrastructure base stations, and repeaters for standards such as GSM, W-CDMA, TD-SCDMA and LTE, as well as in point-to-point systems. The main difference between the two NXP IQ modulators is in output power: 0 dBm for BGX7100HN, and 4 dBm for BGX7101HN, providing solutions for infrastructure cell sizes ranging from small to macro. Next to the high dynamic range and low noise floor, the devices excel in monotonic IP3o behavior versus frequency, in the lowest unadjusted carrier feedthrough (-50 dBm at -7 dBm output power @ 1960 MHz) and in the highest unadjusted sideband suppression in the market (45 dBc at -7 dBm output power @ 1960 MHz). The devices' wide temperature range (-40 degrees to 85 degrees C) makes them well-suited for operation under extreme weather conditions.

A unique feature of the BGX710x series is the fast on/off switching that enables the device to go from power-saving mode to full-spec operation and stable RF performance within 1 microsecond, even for the most demanding Time Division Duplex (TDD) systems. This results in power consumption savings of more than 50 percent.

"Tomorrow's wireless infrastructure systems need technology that enables high RF performance, while still being cost-effective and low-power. Customers who have tested our modulators confirm that the dynamic range and linearity results are superb. The devices' insensitivity to input common mode voltage has enabled savings on our customers' bill of materials. Moreover, the fast on/off switching capability of less than 1 microsecond makes our modulators the preferred choice for TTD systems," said Robbert van der Waal, director of marketing, NXP Semiconductors. "These IQ modulators are great examples of how NXP can free RF designs of performance barriers and help our customers meet the most demanding system requirements."

Availability
The BGX7100HN and BGX7101HN are available now. NXP is displaying the products at European Microwave Week in Amsterdam.

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About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.

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